There are two accepted principles of small laser marking machine:
1. "Hot processing", that is, a laser beam with high energy density (it is a concentrated energy flow) irradiates on the surface of the processed material, the surface of the material absorbs the laser energy and generates thermal excitation in the irradiation area, thus the temperature of the material surface (or coating) increases, which results in the phenomena like metamorphosis, melting, ablation, evaporation and so on.
2. "Cold processing", that is, (UV) photons that have very high load energy break the chemical bonds of the materials (especially organic materials) or the surrounding mediums, so that the material is damaged by nonthermal process. This kind of cold processing is of special significance in laser marking process, because it is not heat ablating, but cold stripping that breaks the chemical bonds without any "heat damage" side effect, so it does not cause heating or thermal deformation in the inner and nearby area of the processed material surface. For example, in the electronics industry, excimer lasers are used to sedimentate chemical thin films on base materials and cut narrow grooves on semiconductor substrates.
Mini laser marking machine can be used to carve many kinds of non-metallic materials. Small laser machine is used in clothing accessories, medical packaging, wine packaging, architectural pottery, beverage packaging, fabric cutting, rubber product, shell nameplate, craft gift, electronic component, leather and other industries.
1. Mini laser machine can be used to carve metal and a variety of nonmetallic materials. Mini laser marking machine is more suitable for fine and high precision product processing.
2. Small laser marker can be applied in electronic component, integrated circuit (IC), electrical appliance, mobile communication, hardware product, tool accessory, precision instrument, glasses and clock, jewelry, auto part, plastic button, building material, PVC pipe, medical instrument and other industries.
3. Applicable materials include: Ordinary metals and alloys (all metals such as iron, copper, aluminum, magnesium, zinc, etc.), rare metals and alloys (gold, silver, titanium), metal oxides (all kinds of metal oxides), special surface treatment (phosphating, aluminum anode, electroplating surface), ABS materials (electrical appliance shells, daily necessities), ink (light transmitting buttons, printed products), epoxy resin (electronic component packaging, insulating layer).