Widely used in adhesive, flexible circuit board, insulation materials, special adhesive tape, optical materials, membrane switch, protective film, shielding material, Mylar, 3M, PVC, PET rubber, PP, conductive tape, foam, dust-proof net, mobile phone accessories and other electronic materials precision die cutting processing. Different from the previous cutting die, laser cutting machine, it is cut with a knife, can also be used to draw, indentation, cutting, positioning, cutting function, vacuum adsorption material cutting machine. The utility model has the advantages of high cutting precision, low production cost, and fast delivery speed. For the electronic material industry to provide a large-scale, small batch, no knife mold, fast die cutting and proofing of professional cutting solutions.
Laser Cutting & Engraving Machine GEM6040KⅡFeature
1. Different accessories are available for specific needs, such as aluminum or iron honeycomb platform, metal grid, different spacing blades and suction platform for soft materials.
2. Lifting platform designed specifically for engraving and cutting thicker materials.
3. The optional rotary clamp is especially for rotary engraving on column and cone.
Laser Cutting & Engraving Machine GEM6040KⅡSpecification
Power
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60/80/100/130w
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Wavelength
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10.64μm
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Power supply
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AC220±10%
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Speed
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0~64 m/min
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Cooling method
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Water
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Working environment
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Clean, less dust
Temp:5~ 40°C, Humidity:5~80%
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Dimension & Weight
Model
|
Work Area
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Weight
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Overall dimension
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GEM6040-KII
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600mm*400mm
|
260Kg
|
1100mm*920mm*1060mm
|
GEM1080-K
|
1000mm*800mm
|
450Kg
|
1750mm*1310mm*1100mm
|
GEM1390-K
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1300mm*900mm
|
410Kg
|
2200mm*1600mm*1300mm
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Laser Cutting & Engraving Machine GEM6040KⅡApplication
Nonmetallic material like rubber, plastic, acrylic, ceramic, crystal, wood, bamboo, and paper etc.