Type |
semi-automatic Wafer Laser MarkingMachine |
Automatic Wafer Laser Marking Machine |
Model |
GEM-AW300 |
GEM-AW300A |
Laser Wavelength |
Uv355 |
Uv355 |
Output Power |
5W |
5W |
Pulse Repetition Fraquency |
30-100KH |
30-100KH |
Marking Area |
290mm x 290mm |
290mm x 290mm |
Platform Area |
400mm x 400mm |
400mm x 400mm |
Processing Distance |
493.3mm |
493.3mm |
Marking Speed |
500 Characters/sec |
500 Characters/sec |
Marking Accuracy |
±0.05mm |
±0.05mm |
Marking Line Width |
<0.020mm |
<0.020mm |
Repetition Accuracy |
±0.002mm |
±0.002mm |
Position Accuracy |
±0.005mm |
±0.005mm |
Position Speed |
2m/s |
2m/s |
Operanng Temperature Environment |
18℃-25℃ |
18℃-25℃ |
Humidity Requirements |
40%-70% |
40%-70% |
Power |
single-phase AC220V 50HZ, < 30A |
single-phase AC220V 50HZ, < 30A |
Power Consump |
<45KW |
<65KW |
L X WXH |
1.5mX1.4mX1.65m |
1.85mX1.4mX1.65m |
Weight |
2.3T |
2.8T |
Item |
Component |
Quantity |
Mark |
1 |
Marble systen |
1set |
china |
2 |
Linear motor movement system |
1set |
china |
3 |
Laser marking system |
1set |
china |
4 |
Laser cooling system |
1set |
china |
5 |
Dedicated high-precision wafer transport robot |
1set |
GEM |
6 |
High precision CCD vision system |
1set |
GEM |
7 |
PC control system |
1set |
china |
8 |
PLC control system (automatic machine) |
1set |
GEM |
9 |
Particle absorber |
1pcs |
GEM |
10 |
Laser protection system |
1set |
china |
This type of machine can be applied to all kinds of wafers, including Si+Adhesive, Si+Glass.
we will contact you within 24 hours.